532702B02500G |
Aavid, Thermal Division of Boyd Corporation |
2,074 |
Heat Sinks High Power, Extruded Style Heat Sink for TO-220, Large Radial Fins, Vertical Mounting, 4.8 n Thermal Resistance, 2.67mm Hole, 50.8mm |
53271-914 |
CCS |
30 |
Development Boards & Kits - PIC / DSPIC DEVELOPMENT KIT FOR PIC12F683 |
5327138 |
TE Connectivity |
30 |
RF Connector Accessories TERM-BLK PCB MT 2ND 12P.5.08 marked |
53272-915 |
CCS |
30 |
Development Boards & Kits - PIC / DSPIC DEVELOPMENT KIT FOR PIC16F877A |
53273-916 |
CCS |
30 |
Development Boards & Kits - PIC / DSPIC DEVELOPMENT KIT FOR PIC16F887 |
53274-2 |
TE Connectivity |
30 |
Terminals TERMINAL BUDG SPR SPD 12-10 5 |
53275-917 |
CCS |
30 |
Development Boards & Kits - PIC / DSPIC DEVELOPMENT KIT FOR PIC18F4520 |
53276-918 |
CCS |
30 |
Development Boards & Kits - PIC / DSPIC DEVELOPMENT KIT FOR PIC16F1937 |
53276-919 |
CCS |
30 |
Development Boards & Kits - PIC / DSPIC DEVELOPMENT KIT FOR PIC18F6722 |
53276-920 |
CCS |
30 |
Development Boards & Kits - PIC / DSPIC DEVELOPMENT KIT FOR PIC18F67J10 |
53276-921 |
CCS |
30 |
Development Boards & Kits - PIC / DSPIC DEVELOPMENT KIT FOR PIC18F8722 |
53276-922 |
CCS |
32 |
Development Boards & Kits - PIC / DSPIC DEVELOPMENT KIT FOR PIC24F |
53276-923 |
CCS |
30 |
Development Boards & Kits - PIC / DSPIC DEVELOPMENT KIT FOR PIC24H |
53276-924 |
CCS |
30 |
Development Boards & Kits - PIC / DSPIC DEVELOPMENT KIT FOR DSP STARTER |
53276-925 |
CCS |
30 |
Development Boards & Kits - PIC / DSPIC DEVELOPMENT KIT FOR DSP ANALOG |